Preparation of PLGA-PEG/Hydroxyapatite Composites via Simple Methodology of Film Formation and Assessment of Their Structural, Thermal, and Biological Features
Künye
ÇİFTÇİ, Fatih & Ali Can ÖZARSLAN. "Preparation of PLGA-PEG/Hydroxyapatite Composites via Simple Methodology of Film Formation and Assessment of Their Structural, Thermal, and Biological Features". Journal of the Turkish Chemical Society Section A: Chemistry, 10.4 (2023): 1123-1132.Özet
This study aimed to develop polymeric composite films suitable for applications in the field of bone
tissue engineering. The preparation of PLGA-PEG/HAP composite films was achieved using a simple
methodology, including mixing, sonication, and casting-drying stages. Characterization analyses, including
FTIR, SEM, TGA-DSC, and XRD, were conducted to assess the properties of the composite films. The results
showed that the PEG polymer decreased the glass transition temperature of the composite, while the HAP
did not change. Further, weight remaining (%) values of HAP, PLGA-PEG, and PLGA-PEG/HAP were found as
94.04, 88.28, and 90.57, respectively. Thus, it can be concluded that HAP improves the thermal stability of
PLGA-PEG. The outcomes of the analysis, encompassing the evaluation of physical, morphological, and
thermal properties, demonstrate that the composite structure comprising PLGA and PEG polymers along with
HAP ceramic material may attain the intended quality. Moreover, fluorescence microscopy was employed to
visualize the interaction between cells and the composite films following DAPI staining to evaluate cell
adhesion and proliferation on the PLGA-PEG/HAP composite films. PLGA-PEG/HAP composite films have no
adverse effects on cells, such as toxicity, and they have also exhibited a favorable influence on cell
proliferation, supporting an augmentation in cellular growth and adhesion. Overall, the results indicate that
the synthesized PLGA-PEG/HAP composite films may hold the potential to serve as a promising candidate for
applications in the field of bone tissue engineering.